Model referenceDiscontinued by manufacturer
FDM Fused Deposition Modeling

WASP 4070 Industrial 4.0 — Technical data

The Delta WASP 4070 Industrial 4.0 is the middle machine of WASP's Industrial 4.0 line presented at the end of 2018 and traces back to the 4070 Industrial shown in 2017. The cylindrical build volume measures Ø 400 × 700 mm; the closed all-metal chamber is actively heated to 80 °C and the aluminium bed to 120 °C. The Spitfire extruder with a 0.7 mm nozzle is standard; the Zen Dual for two materials and the Flex for TPU or TPE were options. The machine weighs around 90 kg and stands almost two metres tall. It was replaced around 2020 by the 4070 Industrial X.

For a used 4070 Industrial 4.0, take careful stock of the extruders, as the Zen and Flex heads were sold separately. Let the chamber reach temperature and check whether prints stay dimensionally accurate after longer runs; heat takes its toll on belts and plastic parts on the carriages. The long delta arms should be free of play and the auto-calibration should complete without aborting. Camera, Wi-Fi and touchscreen depend on the firmware version. For transport the machine must stand upright and secured.

Ø 400 mm700 mm
MaterialsPLAPETGABSHIPSASAPCTPUTPEContinuous carbon fibreSupport material

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
Ø 400 mm700 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

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Buy or have it printed? For small or changing quantities, having parts printed is often cheaper than your own machine. If you regularly fill many build jobs, your own machine pays off.

Specifications

Weight90 kg
Dimensions850 × 770 × 1,950 mm
ExtruderSpitfire (standard), optional Zen Dual or Flex; up to 350 °C
Filament Diameter1.75 mm (Spitfire), 2.85 mm (Flex)
Speedup to 150 mm/s (iMakr blog: 500 mm/s)
Heizbettup to 120 °C, ground aluminium
Chamber temperatureactively heated up to 80 °C
MaterialsPLA, PVA, PETG; ABS, HIPS, ASA, PC, PA, carbon-fibre PA, PC/ABS; TPU, TPE
Layer Resolution0.1 mm (iMakr blog: from 0.05 mm)
InterfaceUSB stick, Wi-Fi, Ethernet; touchscreen, camera
Build Envelope in mm (x/y/z)Ø 400 × 700 mm
Nozzle Diameter0.7 mm (standard); 0.4 and 1.2 mm optional

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All information according to manufacturer specifications, errors excepted.

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