Model reference
FDM Fused Deposition Modeling

HP Industrial Filament 3D Printer 600 HT — Technical data

The HP Industrial Filament 3D Printer 600 HT is HP's first filament system and is aimed at manufacturers producing functional parts from high-temperature plastics such as PEEK, PAEK or PEI. The build volume measures 380 × 380 × 420 mm and is actively heated to up to 195 °C, while the build plate reaches 190 °C. Two printheads use interchangeable modules for 280, 360 or 500 °C, so besides PEEK and carbon-fibre-reinforced PEEK it also processes ABS, PC or PA-CF. An optional Material Management System dries and stores the filament. The software comes from 3DGence; according to press reports the machine is based on the 3DGence Industry F421.

Used 600 HT units will be rare for now. When one appears, check which print modules are included, since they are sold separately, and the condition of nozzles, heaters and build plate. If you plan to process PEEK, budget for the Material Management System. Also clarify the slicer and cloud licences and who provides service (HP or 3DGence).

380 mm380 mm420 mm
MaterialsPEEKPEIABSPCPA CF

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
380 mm380 mm420 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

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Not worth your own machine? We produce your parts – request from the LayerByLayer 3D printing service.

Buy or have it printed? For small or changing quantities, having parts printed is often cheaper than your own machine. If you regularly fill many build jobs, your own machine pays off.

Specifications

Print Head2 print heads with purge system; interchangeable modules M280 (up to 280 °C, nozzle 0.5 mm), M360 (up to 360 °C, nozzle 0.4 mm), M500 (up to 500 °C, nozzle 0.4 mm)
Filament Diameter1.75 mm
MaterialsHigh-performance polymers (PEEK, PEEK-CF, PAEK, PEI), engineering polymers (ABS, PC, PA-CF); open material platform for third-party filaments
Layer Resolutionfrom 50 µm
TemperaturesPrint bed up to 190 °C, build chamber up to 195 °C (actively heated), filament chamber up to 50 °C
Accessories (optional)Material Management System (drying and storage at 50 °C, annealing), print modules available separately
Build Envelope in mm (x/y/z)380 × 380 × 420 mm
Software3DGence Slicer 4.0, 3DGence CONNECT (cloud)

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All information according to manufacturer specifications, errors excepted.

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