Model reference
FDM Fused Deposition Modeling

WASP 60100 HDP — Technical data

The WASP 60100 HDP is WASP's high-temperature pellet printer, first shown at formnext 2022. It fills the gap between the 4070 HDP and the 3MT HDP: the delta build volume measures Ø 600 × 1,000 mm, the bed stays still and only the extruder moves. According to the current manufacturer page, the liquid-cooled HDP extruder reaches 500 °C and delivers up to 500 g/h, while the locally heated FIRECAP chamber reaches 200 °C. Alongside PLA, ABS and recycled granules, WASP therefore lists PEEK, PPS and metal and ceramic feedstocks for MIM and CIM. The machine weighs 300 kg and is 2.55 m tall.

On a used 60100 HDP, high-temperature operation is the main thing to check: the extruder cooling circuit for leaks and coolant level, the heating elements and insulation of the FIRECAP chamber, and the cable routing at the effector. If PEEK or a metal feedstock has been printed, the screw and nozzle wear faster. The vacuum plate should hold parts and release them automatically. Allow for an 8 bar compressor, the 35 l pellet tank and a supply of up to 3.5 kW. Ask whether drying equipment for the granules is included, as engineering plastics need it.

Ø 600 mm1,000 mm
MaterialsASAPPTPUPEEKPCPPSU / PSU / PPSPLAABSCeramic (unspecified)

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
Ø 600 mm1,000 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

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Specifications

Dimensions1,090 × 1,000 × 2,550 mm
Compressed Air8 bar, 50 l/min, 6 × 8 mm hose; compressor not included
ExtruderHDP pellet extruder (FGF), liquid-cooled, pneumatic feed, max. 500 g/h, hotend up to 500 °C (2024 brochure: 450 °C)
Speedprinting 200 mm/s, travel 300 mm/s
Weight300 kg (packed 650 kg)
Heizbettup to 120 °C; vacuum plate with automatic release, interchangeable plates
Chamber temperatureup to 200 °C (FIRECAP, locally heated chamber, patented)
Materialspellets up to 3 × 3 mm: ASA, PP, TPU, PEEK, PC, PPS, MIM metal and CIM ceramic feedstocks, wood-filled PLA, PLASMIX, recycled pellets; official WASP PLA and ABS pellets
Layer Resolution0.1–1.5 mm
Build Envelope in mm (x/y/z)Ø 600 × 1,000 mm
Nozzle Diameter1 / 2 mm (2024 brochure: 0.7–3 mm)
Power Supply220/240 V, 50/60 Hz, max. 3.5 kW, average 1 kW (110 V available)

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All information according to manufacturer specifications, errors excepted.

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