Raise3D DF2 — Technical data

The Raise3D DF2 is a DLP resin printer with which Raise3D extended its range beyond filament extrusion. A projector with an industrial DMD chip from Texas Instruments exposes a full layer at 2,560 × 1,440 pixels; the build volume is 200 × 112 × 300 mm and layer thickness 50 to 200 µm. Resin is refilled automatically, and the build platform carries an RFID chip that passes the resin type and wash and cure parameters on to the DF Wash and DF Cure post-processing units. Besides Raise3D's own resins, industrial resins from LOCTITE and Ultracur3D are approved. The machine targets functional prototypes, small parts with fine detail and fixtures. The faster sibling model is the DF2+.

A used DF2 should ideally be offered together with DF Wash and DF Cure, since the process chain is matched to them. Check the condition of the resin tank and its film, the projector's exposure hours, cleanliness of the optics and whether RFID platforms and resin tanks are included. Opened resins have an expiry date and should not be counted at face value.