Model reference
DLP Digital Light Processing

Envisiontec Xtreme 8K — Technical data

The Xtreme 8K is the large-format system among EnvisionTEC's DLP printers, marketed as ETEC under Desktop Metal. An industrial UV projection system cures resin in a 450 × 371 × 399 mm build volume at a native 150 µm, enhanced 100 µm XY resolution, with layer heights of 100 to 175 µm. It processes resins for hard and heat-resistant plastics as well as elastomers. Typical uses are large prototypes, casting patterns and small series of plastic parts. Since EnvisionTEC GmbH was sold to Anzu Partners in 2025 the machine is no longer part of the Desktop Metal portfolio; its current sales status is unclear.

Weighing over 900 kg and standing more than two metres tall, the Xtreme 8K is not a benchtop machine. When buying used, check projector hours and light output, the condition of the resin vat and build platform, and the availability of suitable resins. The data sheet specifies a 208 V three-phase supply, so for European sites the delivered version must be clarified. Software, service and spare parts now rest with EnvisionTEC GmbH – identify a contact before buying.

450 mm371 mm399 mm
MaterialsPhotopolymer resin (general)

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
450 mm371 mm399 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

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3 · Have parts printed

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Buy or have it printed? For small or changing quantities, having parts printed is often cheaper than your own machine. If you regularly fill many build jobs, your own machine pays off.

Specifications

Weight907 kg
Dimensions1,420 × 1,052 × 2,083 mm (L × W × H)
ResolutionXY native 150 µm, enhanced 100 µm
Connectivitydirectly to PC workstation or to network
Light Sourceindustrial UV light engine (DLP)
MaterialsResins for rigid plastics, high-temperature plastics, elastomers and rubber-like materials
Layer Resolution100–175 µm (Z resolution)
Build Envelope in mm (x/y/z)450 × 371 × 399 mm
Power Supply208 V AC, three-phase, 20 A

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All information according to manufacturer specifications, errors excepted.

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