Model referenceDiscontinued by manufacturer
SLA Stereolithography

Envisiontec Xtreme 3SP — Technical data

The Xtreme 3SP is the large model of EnvisionTEC's 3SP range. Instead of projecting a layer image, 3SP technology, short for Scan, Spin and Selectively Photocure, guides light line by line across the resin and cures the contour much like stereolithography. The build volume measures 254 × 381 × 330 mm, the XY grid 100 µm, and layer thickness is adjustable between 50 and 100 µm. At 680 kg, with a footprint of 1.63 × 1.40 m and a height of 1.83 m, it is an industrial machine running on 220 V single-phase. The intended materials were E-Denstone for dental and casting models, ABS-3SP White and transparent E-Glass.

When buying a used Xtreme 3SP, transport and spare parts come first: the machine needs a pallet truck or crane and a level site, and 3SP technology is no longer built. Check the exposure unit and its running time, vat, platform and drives, plus the integrated PC with software and licences. Existing resin stocks should be within shelf life, as future supply is uncertain. Maintenance logs and a test print reveal the condition.

254 mm381 mm330 mm
MaterialsABSDental resin

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
254 mm381 mm330 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

1 · Buy

Matching used machines for this material and build volume.

2 · Let us search

Nothing suitable? We will search for you – or get an e-mail as soon as a matching machine comes in.

3 · Have parts printed

Not worth your own machine? We produce your parts – request from the LayerByLayer 3D printing service.

Buy or have it printed? For small or changing quantities, having parts printed is often cheaper than your own machine. If you regularly fill many build jobs, your own machine pays off.

Specifications

Weight680 kg
Dimensions1,630 × 1,400 × 1,830 mm (L × W × H)
ResolutionXY 100 µm
MaterialsE-Denstone 3SP, ABS-3SP White, E-Glass 3SP
Layer Resolution50–100 µm (adjustable, material dependent)
Build Envelope in mm (x/y/z)254 × 381 × 330 mm
Softwareautomatic support generation; standalone PC, network connection; STL data format
Power Supply220 V, single-phase, 15 A

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All information according to manufacturer specifications, errors excepted.

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