Model referenceDiscontinued by manufacturer
FDM Fused Deposition Modeling

Bambu Lab P1P — Technical data

The P1P was the open entry model of the P1 series and adopted the X1's mechanics, electronics and motion control, but dispensed with the enclosure, colour display and lidar. It prints at up to 500 mm/s over a 256 × 256 × 256 mm build volume; a hot end rated to 300 °C and a bed reaching 100 °C target PLA, PETG and ASA. Many owners enclosed it with printed parts or retrofit kits. Bambu Lab ended production and sales in February 2026 without naming a direct successor; the P1S and P2S continue the line.

As the P1P was popular for tinkering, ask about modifications when buying used: home-printed enclosures, different hot ends or changed fans affect thermal behaviour and the choice of spare parts. The camera only outputs still frames. Given the open design as delivered, ABS hardly makes sense without an enclosure. Check belts, nozzle, bed surface and Z lead screws. The seller must unbind the unit from their Bambu account. Bambu Lab promises spare parts and technical support until February 2031 and security updates until November 2029.

256 mm256 mm256 mm
MaterialsPLAPETGTPUASA

How many fit in one build job?

Material
Part (bounding box)
××mm
One layer on the build platform.
–Parts per build job
–Build jobs for the quantity
–Build volume utilisation
256 mm256 mm256 mm
Approximation using the bounding box and 0.5 mm spacing. Real nesting of free-form parts usually fits more.

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Buy or have it printed? For small or changing quantities, having parts printed is often cheaper than your own machine. If you regularly fill many build jobs, your own machine pays off.

Specifications

Dimensions386 × 389 × 458 mm
Print Speedmax. 500 mm/s, acceleration max. 20 m/s²
Nozzle temperaturemax. 300 °C
ExtruderDirect drive, all-metal hot end, 0.4 mm stainless steel nozzle
Filament Diameter1.75 mm
Weight9.65 kg net
Chamber temperatureopen frame without enclosure
MaterialsPLA, PETG, TPU, ASA (manufacturer's focus on PLA, PETG, ASA)
InterfaceWi-Fi, Bluetooth, Bambu-Bus, microSD; 2.7-inch display with buttons
Build Platformmax. 100 °C; Cool, Engineering and High Temperature plates compatible; double-sided textured PEI plate
Build Envelope in mm (x/y/z)256 × 256 × 256 mm
Power Supply100–240 V AC, 50/60 Hz; 1,000 W at 220 V, 350 W at 110 V

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All information according to manufacturer specifications, errors excepted.

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